On September 12, 2024, D.O. Bond Co., Ltd. participated in the scholarship awarding ceremony for students of the School of Architecture and Design, Walailak University. The event was held at Hua Tapan Conference Room, Chulabhorn Vejvattana Building, Walailak University Medical Center. Representatives from the company, faculty members, and honored guests attended the event.
The purpose of this ceremony was to support education and promote the potential of students who are dedicated to the fields of architecture and design. The scholarships were awarded to outstanding students with strong academic performance and financial need, aiming to relieve financial burdens and foster academic development.
This scholarship presentation reflects D.O. Bond Co., Ltd.’s commitment to creating value for society through educational support and emphasizes the importance of nurturing the next generation of professionals in architecture and design.
