“Burapha Architect ’68” was held from 30–31 January 2026, serving as a platform for the exchange of academic and professional knowledge in architecture, while promoting
by Providing Scholarships to Architecture Students at Rajamangala University of Technology Srivijaya D.O. Bond Co., Ltd. recognizes the importance of education as a fundamental driver
D.O. Bond Co., Ltd. continues to emphasize the importance of sustainable construction and energy-efficient building materials by actively supporting academic knowledge exchange with higher education
On January 23, 2026, D.O. Bond Co., Ltd. organized an educational site visit for third-year students from the Faculty of Architecture, Urban Design and Creative
“Burapha Architect ’68” was held from 30–31 January 2026, serving as a platform for the exchange of academic and professional knowledge in architecture, while promoting
by Providing Scholarships to Architecture Students at Rajamangala University of Technology Srivijaya D.O. Bond Co., Ltd. recognizes the importance of education as a fundamental driver
D.O. Bond Co., Ltd. continues to emphasize the importance of sustainable construction and energy-efficient building materials by actively supporting academic knowledge exchange with higher education
On January 23, 2026, D.O. Bond Co., Ltd. organized an educational site visit for third-year students from the Faculty of Architecture, Urban Design and Creative
D.O. BOND Company Limited.
69/1 Moo 2, Soi Wat Ratburana,
Thepharak Road, Bangpla, Bangphli,
Samut Prakan 10540 THAILAND.
Tel.: +66 2 752 3605 – 7
E-mail: [email protected]
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